IC / Package Design Services
Advanced IC packaging and substrate design solutions for high-performance semiconductor applications.
OVERVIEW
Advanced IC & Package Engineering
Logic Aura provides IC package and substrate design solutions including flip-chip, wire bond, BGA/CSP packaging, thermal analysis, and manufacturing-ready documentation for modern semiconductor systems.
WHAT WE OFFER
Our IC Package Design Services
IC Package Design
- Substrate layout support
- Signal/power routing
- Package stack-up planning
Flip-Chip & Wire Bond
- Flip-chip implementation
- Wire bond optimization
- Interconnect planning
Thermal & Reliability
- Thermal considerations
- Mechanical reliability support
- SI/PI awareness
Package Documentation
- Manufacturing documentation
- Design rule verification
- Vendor coordination
